Multi-layer wiring board
US5479138A · kind A · utility
33Cited by
2References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 27, 1994 |
| Grant date | Dec 26, 1995 |
| Priority date | — |
| Expiry date | Dec 27, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09681
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In a multi-layer wiring board having a strip line structure in which a grounding conductor wiring and a signal circuit wiring are disposed by interposing therebetween an insulation layer, the grounding conductor wiring is in the form of a grid and an open area ratio Rx [%]of the grid and a line width ratio Ry=Wg/Ws have a relationship expressed by Ry, .ltoreq.25.98.times.Rx.sup.-0.3871 -4.370 where Wg is the line width of the grounding conductor wiring, Sg is the width of an opening of the grid, Ws is the line width of the signal circuit wiring, and Rx={Sg/(Wg+Sg)}.sup.2 .times.100.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.