Method of drilling a hole for printed wiring board
US5480269A · kind A · utility
13Cited by
5References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 6, 1994 |
| Grant date | Jan 2, 1996 |
| Priority date | — |
| Expiry date | Jun 6, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T408/44
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of drilling a through-hole for inter-surface conduction in a laminate for a printed wiring board, in which the heat generation in a drill bit can be inhibited in drilling holes, quality holes can be highly efficiently made in the presence, on the laminate surface, of a novel water-soluble lubricant sheet which has high strength and can be handled easily, the method comprising drilling the through-holes in the presence of a water-soluble lubricant sheet which has a thickness of 0.02 to 3 mm and is formed from a mixture of 20 to 90% by weight of a polyether ester with 10 to 80% by weight of a water-soluble lubricant.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.