Brushless electrodeposition apparatus
US5480528A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 25, 1994 |
| Grant date | Jan 2, 1996 |
| Priority date | — |
| Expiry date | Feb 25, 2014 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D17/00
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An apparatus for depositing metal which provides a brushless electrical current continuity between a member, such as an electroforming mandrel or an electroplating rack, and a current source, comprising: (a) an electrode; (b) a member, spaced apart from the electrode, wherein the member defines a space that is partially or fully filled with a first conductive liquid in electrical contact with the member; (c) a second conductive liquid electrically isolated from the electrode; and (d) connecting means for electrically connecting the first conductive liquid and the second conductive liquid.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.