Multi-chip module with multiple compartments
US5480840A · kind A · utility
123Cited by
8References
3Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Aug 18, 1994 |
| Grant date | Jan 2, 1996 |
| Priority date | — |
| Expiry date | Aug 18, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49137
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention provides a multi-chip module having multiple compartments. Circuitry is arranged on a substrate in such a manner that circuit components requiring specific operating environments are located in discrete areas dedicated to accommodate the circuit components. A cover, having multiple chambers that align with the discrete areas on the substrate, is secured to the substrate to define the multiple compartments. The compartments are separated by material that effectively isolates the compartments relative to one another.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.