Method for fabricating thin, strong, and flexible die for smart cards
US5480842A · kind A · utility
123Cited by
12References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 11, 1994 |
| Grant date | Jan 2, 1996 |
| Priority date | — |
| Expiry date | Apr 11, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/977
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Improved methods for fabricating smart cards are disclosed. Semiconductor die approximately 0.004 to 0.007 inches thick are fabricated using chemical stress relief processes and UV dicing tape. The die are positioned substantially on the neutral axis of a smart card, thereby providing smart cards having improved resistance to mechanical flexure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.