Soldering apparatus with improved filter
US5481087A · kind A · utility
17Cited by
7References
13Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 12, 1993 |
| Grant date | Jan 2, 1996 |
| Priority date | — |
| Expiry date | Nov 12, 2013 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K1/012
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A soldering device has a chamber; soldering means for soldering objects which are transported through the chamber; a transporting means in the chamber for transporting the objects for soldering along a transport route; a cleaning means for cleaning gases present in the chamber, which cleaning means being connected to the chamber with a feed line and a discharge line; and a fan situated in one of the lines. A cooling device to cool the gases is situated in one of the lines. The soldering device is preferably a reflow-soldering device, wherein the soldering means are formed by heating means.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.