Apparatus assembly of an electrotechnical apparatus
US5481437A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Apr 4, 1994 |
| Grant date | Jan 2, 1996 |
| Priority date | — |
| Expiry date | Apr 4, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K9/0062
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The invention provides a low cost apparatus assembly of an electrotechnical apparatus. The housing walls consist of plate-shaped elements. The dimensions and weight of the plate-shaped elements are considerably reduced as compared to the existing elements. The assembly has a housing wall with plate-shaped elements. At least part of the plate-shaped elements are synthetic plastic plates, which are metal-coated over a continuous surface area on one side. The metal-coated surfaces are interconnected electrically conductively. One or several of the metal-coated synthetic plastic plates are designed as printed circuit boards. They are provided with electrical and/or mechanical elements on the side which is not metal-coated. As the case may be, they are provided with strip conductors. The plate-shaped elements of metal, if present, are electrically conductively connected to the metal-coated surface of the synthetic plastic plates. Other important properties, particularly those relating to the protection of the apparatus against mechanical influences such as shock, vibration, influences of temperature, humidity and the like and also the protection against electrical and electromagnetic fi…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.