Socket apparatus for IC package testing
US5482471A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 16, 1994 |
| Grant date | Jan 9, 1996 |
| Priority date | — |
| Expiry date | Feb 16, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/1084
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A socket for testing integrated circuit (IC) packages (100) has a lower block (10) with a plurality of contact elements (11) movable between open and closed positions mounted therein, an upper block (20) fixed on the lower bock (10) and formed with a lead insertion hole (21) for the insertion of each lead (101) of the IC package (100), a cover member (30) adapted for vertical, up and down movement relative to the upper block (20), and a spring biased slide block (40) mounted to slidably reciprocate in a recess formed between the upper and lower blocks (10,20) in a direction which crosses, at approximately a right angle, the direction in which a lead (101) of an IC package (100) would be inserted into an opened contact element (11). The slide block (40) has a plurality of apertures (41) for opening and closing contact elements (11) upon movement of the cover member (30) by the use of a contact part opening and closing element (50) converting movement of the cover (30) to sliding action of the slide block (40).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.