Halogen-free flameproofed thermoplastic polyamide molding materials

US5482985A · kind A · utility

Assignee

• BASF SE

Inventors

• Petra Baierweck · Schifferstadt, DE
• Brigitte Gareiss · Grünstadt, DE
• Karlheinz Ulmerich · Lambsheim, DE
• Michael Gall · Cordova, US
• Manfred Koetting · Mutterstadt, DE

Key dates

• Filing date: Mar 24, 1995
• Grant date: Jan 9, 1996
• Expiry date: Mar 24, 2015

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C08K7/00
• WIPO field: Macromolecular chemistry, polymers
• WIPO sector: Chemistry

Abstract

Flameproofed thermoplastic polyamide molding materials contain PA1 A) from 40 to 98% by weight of a thermoplastic polyamide, PA1 B) from 0.5 to 30% by weight of melamine cyanurate, PA1 C) from 0.5 to 50% by weight of magnesium hydroxide, PA1 D) from 1 to 50% by weight of a fibrous or particulate filler or of a mixture thereof which differs from B) and C) and PA1 E) from 0 to 30% by weight of conventional additives or processing assistants.