Thermoplastic molding materials based on partly aromatic copolyamides and polyolefins

US5482998A · kind A · utility

Assignee

• BASF SE

Inventors

• Klaus Muehlbach · Havelsee, DE
• Petra Baierweck · Schifferstadt, DE
• Wolfgang Mueller · Wappingers Falls, US
• Gerd Blinne · Worms, DE
• Gerhard G. Ramlow · Grosse Ile Township, US

Key dates

• Filing date: Aug 8, 1994
• Grant date: Jan 9, 1996
• Expiry date: Aug 8, 2014

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C08L2205/08
• WIPO field: Macromolecular chemistry, polymers
• WIPO sector: Chemistry

Abstract

Thermoplastic molding materials contain PA0 A) 4-94% by weight of a partly aromatic, semicrystalline copolyamide having a triamine content of less than 0.5% by weight and composed of PA1 (A.sub.1) 20-90% by weight of units derived from terephthalic acid and hexamethylenediamine, PA1 (A.sub.2) 0-50% by weight of units derived from .epsilon.-caprolactam, PA1 (A.sub.3) 0-80% by weight of units derived from adipic acid and hexametheylenediamine and PA1 (A.sub.4) 0-40% by weight of further polyamide-forming monomers, PA0 the amount of components (A.sub.2) or (A.sub.3) or (A.sub.4) or of mixtures thereof being not less than 10% by weight, PA0 B) 4-94% by weight of a polyolefin homo- or copolymer or a mixture thereof, PA0 C) 2-20% by weight of an adhesion promoter, PA0 D) 0-20% by weight of a toughening polymer and PA0 E) 0-60 % by weight of additives and processing assistants.