Method of making homogeneous thermoplastic semi-conductor chip carrier package
US5483740A · kind A · utility
18Cited by
2References
6Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 28, 1994 |
| Grant date | Jan 16, 1996 |
| Priority date | — |
| Expiry date | Nov 28, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49126
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A homogeneous thermoplastic semi-conductor chip carrier cavity package (HC package) which utilizes the same thermoplastic for various integral attachments to the HC package, such as, a molded lid and a circuit substrate. A chemical bonding or fusing of the integral attachments to the HC package provides increased protection from having moisture enter into the cavity of the HC package. The HC package eliminates problems which are associated with having different coefficients of thermal expansion for the HC package and its various integral attachments.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.