Thermal isolation structure for hybrid thermal imaging system
US5485010A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 13, 1994 |
| Grant date | Jan 16, 1996 |
| Priority date | — |
| Expiry date | Jan 13, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/73253
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A mesa-type structure (52) is formed from polyimide (or a similar polymer material) to achieve a supporting structure for mounting a focal plane array (30 and 130) on an integrated circuit substrate (70 and 170). In an exemplary thermal imaging system (20 and 120), a thermal isolation structure (50 and 150) is disposed on an integrated circuit substrate (70 and 170) for electrically connecting and mechanically bonding a corresponding focal plane array (30 and 130) of thermal sensors (40 and 140). Each mesa-type structure (52 and 152) initially includes a polyimide mesa (54) over which is formed a reinforcing layer (56 and 156) and a metal conductor (58, 158 and 168) that extends from the top of the mesa-type structure (52 and 152) to an adjacent contact pad (72, 172 and 174). After the focal plane array (30 and 130) is bonded to the corresponding array of mesa-type structures (52 and 152), the polyimide mesas (54) are removed to create void spaces (60 and 160). The resulting mesa-type structures (52 and 152) provide a thermally isolated, but electrically conductive path between the sensor signal electrode (44 and 144) of each thermal sensor (40 and 140) and the corresponding contac…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.