Patent · US Expired

Two-sided integrated-circuit PIR sensor package

US5485011A · kind A · utility

3Cited by
4References
1Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJan 28, 1994
Grant dateJan 16, 1996
Priority date
Expiry dateJan 28, 2014

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG01J5/07
  • WIPO fieldMeasurement
  • WIPO sectorInstruments

Abstract

A two-sided passive infrared integrated-circuit sensor package for use in infrared motion detectors as well as other infrared sensing applications. The integrated-circuit sensor package has a casing with viewing windows transmissive to infrared radiation on opposite sides. Infrared sensing elements are mounted within the integrated circuit package so that both sides of the sensing elements are able to receive infrared radiation through the viewing windows from the areas in front of and behind the integrated-circuit package. By this simple mechanical change in the package and sensing element mounting, the area of sensitivity of the sensor is effectively doubled with no change in the electronic design of the circuit and with no increase in the number or size of the infrared-sensitive sensing elements within the IC package.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.