Method for encasing a printed wiring board
US5485672A · kind A · utility
15Cited by
17References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 21, 1993 |
| Grant date | Jan 23, 1996 |
| Priority date | — |
| Expiry date | Jun 21, 2013 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49146
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The invention provides an apparatus (10) for encasing a printed wiring board (12). Apparatus (10) comprises a substantially tubular housing (14) having internal ribs (30) formed along first and second sides (32) and (34) of housing (14). Printed wiring board (12) is received in housing (14) and maintained in place by ribs (30). An end cap (18) having an aligning member (36) is placed in a first opening (22) of housing (14). A coupling member (20) comprising a connector (40) and a support shell (42) is inserted into a second opening (28) of housing (14).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.