Lead frame for integrated circuits

US5486721A · kind A · utility

Assignee

• W. C. Heraeus GmbH · DE

Inventors

• Gunter Herklotz · Bruchköbel, DE
• Heinz Forderer · Barby, DE
• Thomas Frey · Brighton, US

Key dates

• Filing date: Mar 31, 1994
• Grant date: Jan 23, 1996
• Expiry date: Mar 31, 2014

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/14
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Lead frames completely surface-plated with palladium have a nickel-phosphorus or copper-tin layer between the base element, made for example of copper, and the palladium layer. Such lead frames exhibit good bondability and good solderability without tinning.