Burn-in socket testing apparatus
US5486771A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 23, 1994 |
| Grant date | Jan 23, 1996 |
| Priority date | — |
| Expiry date | Dec 23, 2014 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R1/0433
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
This invention is directed to a mechanical, robotically operated burn-in socket testing apparatus for integrated circuit "chips", where such chips, as known in the art, are typically planar electronic devices. The apparatus, operationally mounted to a planar electronic board, such as a mother board, comprises a first frame member for mounting to the mother board, where the first frame member includes electrical means for engaging chip leads and applying electrical current thereto during the burn-in testing. A second frame member is disposed in sliding engagement with the first frame member, where the second frame member is movable from a first position to a second position. Finally, cooperative latching and camming means are provided between the first and second frame members to effect the movement between the first and second positions, and to securely hold the chip during burn-in, where the camming means includes a pivotal member movable from a remote position free of the chip to a position engaging the chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.