Patent · US Expired

Method and apparatus for simultaneous write head planarization and lead routing

US5486968A · kind A · utility

15Cited by
11References
51Claims
0Family size

Assignee

Inventors

Key dates

Filing dateNov 10, 1993
Grant dateJan 23, 1996
Priority date
Expiry dateNov 10, 2013

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG11B5/3967
  • WIPO fieldAudio-visual technology
  • WIPO sectorElectrical engineering

Abstract

Disclosed is a planarizing layer for use in an MR read/inductive write head combination, and a method for constructing the same. In the preferred embodiment, a planarizing layer comprising a plurality of planar sections of conductive material is formed in the plane of the lower pole piece of an inductive head. The planar sections, in cooperation with the lower pole piece, provide a substantially planar surface on which to form the inductive coil. Two of the planar sections are electrically coupled to respective MR leads, and include protrusions extending from the perimeter of the inductive coil to enable electrical access by a pair of read terminal pads. A third planar section is electrically coupled to the inner coil tap of the inductive coil, and includes a protrusion extending from the perimeter of the inductive coil to enable electrical access by a write terminal pad.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.