Lead conditioning system for semiconductor devices
US5487416A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Dec 3, 1993 |
| Grant date | Jan 30, 1996 |
| Priority date | — |
| Expiry date | Dec 3, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K13/0092
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An apparatus and method for conditioning the leads of a semiconductor device having parallel leads formed to a predetermined configuration. The apparatus includes a device for engaging and massaging the leads to reintroduce a predetermined spacing between the leads, bringing the leads into parallelism. The apparatus also includes a device for forming the leads to a partially unbent condition having at least one clamping arm pivotal between a first position spaced from the leads and a second position compressing a portion of the leads between the clamping arm and the support. The apparatus further includes a device for reforming the leads to a predetermined configuration. The lead conditioning method includes the steps of bringing the leads into parallelism, positioning the semiconductor device on a support, forming the leads to a partially unbent condition by pivoting at least one arm toward the leads and compressing a portion of the leads between the arm and the support, and shaping the leads to a partially unbent condition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.