Surface mountable leaded package
US5487674A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 6, 1993 |
| Grant date | Jan 30, 1996 |
| Priority date | — |
| Expiry date | Jul 6, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R13/24
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method and an apparatus provide a surface mountable package (100) with leads (150) having free end portions (355) coplanar in a target plane (370). The method includes forming the leads (150) such that the free end portions (355) angle away from the target plane (370), and biasing the free end portions (355) against a biasing surface (365) integral to the package (100) such that the free end portions (355) are forced toward the target plane (370) and into a coplanar state. The apparatus includes a housing (110), a plurality of leads (150) with free end portions (355) preformed to angle away from the target plane (370) mounted onto the housing (110), and a biasing surface (365), located on the package (100), to bias the free end portions (355) toward the target plane (370).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.