Molecular assemblies as protective barriers and adhesion promotion interlayer
US5487792A · kind A · utility
77Cited by
25References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 13, 1994 |
| Grant date | Jan 30, 1996 |
| Priority date | — |
| Expiry date | Jun 13, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31678
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A protective diffusion barrier having adhesive qualifies for metalized surfaces is provided by a passivating agent having the formula HS--(CH.sub.2).sub.11 --COOH Which forms a very dense, transparent organized molecular assembly or layer that is impervious to water, alkali, and other impurities and corrosive substances that typically attack metal surfaces.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.