Cooling device for semiconductor packages, having flexible film heat expulsion means
US5488255A · kind A · utility
17Cited by
3References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 7, 1993 |
| Grant date | Jan 30, 1996 |
| Priority date | — |
| Expiry date | Dec 7, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15192
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A cooling device according to the present invention, in which a space is formed by means of flat electrodes and side plates disposed on the ends of the flat electrodes, and a flexible film fastened in that space in a shape of the letter S, is fixed to a semiconductor package so that one of the flat electrodes is fitted on the semiconductor package. The respective flat electrodes are alternately powered to move the S shaped section of the flexible film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.