Packaging architecture for phased arrays
US5488380A · kind A · utility
300Cited by
16References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 20, 1993 |
| Grant date | Jan 30, 1996 |
| Priority date | — |
| Expiry date | Sep 20, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01Q21/0087
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A dipole antenna is inserted into a waveguide to couple EM energy into and out of a waveguide. The dipole antenna is printed on a substrate of a module that contains electronic components. The substrate includes a coupled coplanar strip transmission line connecting the dipole antenna to a slotline. EM energy is electromagnetically coupled between the slotline and a microstrip transmission line. The EM energy is provided to and from the hermetically sealed electronic components by the microstrip transmission line.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.