Protecting cot packaged ICs during wave solder operations
US5488539A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 21, 1994 |
| Grant date | Jan 30, 1996 |
| Priority date | — |
| Expiry date | Jan 21, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0557
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method and apparatus is disclosed for protecting a solder pad for a chip on tape packaged integrated circuit mounted on a surface of a printed circuit board that is exposed to a wave soldering operation. A pad cover may be used to protect the solder pad. The pad cover is mounted over the solder pad in a manner that protects the solder pad from being exposed to solder during the wave solder operation. After the wave solder is completed, the cover is removed and the leads of the chip on tape packaged integrated circuit are connected to associated solder pad traces on the printed circuit board. This type of arrangement is particularly useful in arrangements which require a heat sink to cool the chip on tape packaged integrated circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.