Semiconductor laser device having chip-mounted heating element
US5488625A · kind A · utility
8Cited by
6References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 5, 1993 |
| Grant date | Jan 30, 1996 |
| Priority date | — |
| Expiry date | Oct 5, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/4056
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A semiconductor device includes a chip, a laser element formed on the chip and a heating element formed on the chip. The laser element is driven to emit a laser beam upon light-on of a laser. Upon light-off of a laser, switching is made so that the heating element is driven so as not to emit the laser beam in the normal laser beam emission direction by the laser element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.