Apparatus for applying organic material to semiconductor wafer in which the nozzle opening adjusts in response to data
US5489337A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 25, 1994 |
| Grant date | Feb 6, 1996 |
| Priority date | — |
| Expiry date | Jan 25, 2014 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB05C11/1021
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An organic material applying apparatus of the present invention includes a movable organic material discharge nozzle having an organic material discharge port for discharging an organic material at a position facing a semiconductor wafer. The opening width of the discharge port is adjustable. A movement time of the nozzle measured from a predetermined position of the semiconductor wafer at a predetermined velocity of relative movements of the nozzle and semiconductor wafer is detected by a movement time detecting device. A width of that portion of the semiconductor wafer, which the discharge port of the moved nozzle faces, is calculated by a wafer width calculating device on the basis of the movement time of the nozzle detected by the movement time detecting device. The opening width of the discharge port of the nozzle is adjusted by a nozzle discharge port opening width adjusting device in accordance with the wafer width calculated by the wafer width calculating device. Thereby, the amount of wasted organic material discharged from the nozzle is reduced.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.