Molding materials having stress cracking resistance and based on PMMA/SAN blends

US5489633A · kind A · utility

Assignee

• BASF SE

Inventors

• Andreas Deckers · Flomborn, DE
• Daniel Wagner · Bad Dürkheim, DE
• Guenter Zimmer · Mainz, DE

Key dates

• Filing date: May 26, 1994
• Grant date: Feb 6, 1996
• Expiry date: May 26, 2014

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C08K5/526
• WIPO field: Macromolecular chemistry, polymers
• WIPO sector: Chemistry

Abstract

Molding materials having stress cracking resistance containing A) from 49 to 99% by weight of a polymer obtainable by polymerizing a C.sub.1 -C.sub.20 -alkyl ester of methacrylic or acrylic acid or a mixture of said esters, B) from 0.95 to 50% by weight of a polymer obtainable by polymerizing a monomer mixture comprising PA1 b.sub.1) from 75 to 82% by weight of a vinyl aromatic monomer and PA1 b.sub.2) from 18 to 25% by weight of acrylonitrile or methacrylonitrile or a mixture thereof, and C) from 0.05 to 1% by weight of a mixture containing PA1 c.sub.1) a triaryl phosphite of the formula I ##STR1## c.sub.2) an amine of the formula II ##STR2## where n is from 2 to 10, c.sub.3) a benzotriazole of the formula III ##STR3## and C.sub.4) a phenol.