Solder-bonded structure
US5489803A · kind A · utility
13Cited by
3References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 18, 1994 |
| Grant date | Feb 6, 1996 |
| Priority date | — |
| Expiry date | Mar 18, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3457
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An improved solder-bonding structure is disclosed that is particularly suitable for soldering the components of hybrid ICs. The solder-bonding structure includes a conductor formed on a substrate. The conductor is formed from silver and platinum. A solder layer formed from a tin and silver solder is then formed on the conductor to couple an electronic element to the conductor. In preferred aspects of the invention, the platinum content in the conductor is in the range of approximately 0.7 to 1.0% by weight. The silver content in the solder layer is in the range of approximately 0.1 to 5.0% by weight.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.