Identification of pin-open faults by measuring current or voltage change resulting from temperature change
US5489851A · kind A · utility
23Cited by
7References
28Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 5, 1994 |
| Grant date | Feb 6, 1996 |
| Priority date | — |
| Expiry date | Dec 5, 2014 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/70
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method and apparatus for determining whether semiconductor components are electrically connected to a printed circuit board. A voltage (or current) is connected to two traces leading to connections to a semiconductor component to be tested. The initial current (or voltage) is measured at an initial temperature. Then, the temperature of the semiconductor is changed. Current (or voltage) is measured again after the temperature change. A change in current (or voltage) indicates that the semiconductor component is electrically connected to the trace.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.