Method for gas bubble and void control and removal from metals
US5490187A · kind A · utility
5Cited by
1References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 13, 1994 |
| Grant date | Feb 6, 1996 |
| Priority date | — |
| Expiry date | Jun 13, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P10/20
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A method for enhancing the diffusion of gas bubbles or voids attached to impurity precipitates, and biasing their direction of migration out of the host metal (or metal alloy) by applying a temperature gradient across the host metal (or metal alloy). In the preferred embodiment of the present invention, the impurity metal is insoluble in the host metal and has a melting point lower than the melting point of the host material. Also, preferably the impurity metal is lead or indium and the host metal is aluminum or a metal alloy.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.