Heating units for use in semiconductor-producing apparatuses and production thereof
US5490228A · kind A · utility
25Cited by
29References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 23, 1993 |
| Grant date | Feb 6, 1996 |
| Priority date | — |
| Expiry date | Mar 23, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wafer heater for use in a semiconductor producing apparatus or the like. The heater includes a discoidal substrate made of a dense ceramic, and a resistance heating element buried in the substrate. The surface of the substrate other than that surface upon which a wafer is to be placed for heating is a flat surface. The heating unit further includes a hollow sheath of which inner pressure is not substantially varied even when the pressure inside the chamber changes and is partially embedded and joined to the heater, and a thermocouple inserted into the hollow sheath.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.