Tapered alignment guide arrangement for self aligning part excision die members in tape automated bonding apparatus
US5490317A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jun 16, 1994 |
| Grant date | Feb 13, 1996 |
| Priority date | — |
| Expiry date | Jun 16, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T83/8855
- WIPO fieldMechanical elements
- WIPO sectorMechanical engineering
Abstract
The lower ends of alignment bearing shafts of an upper die member of a tape automated bonding apparatus are modified to include tapered alignment pins, each having a tapered surface that is complementary to the tapered interior end of the bore of a respective bushing on a lower die member. The alignment pin serves to guide its associated alignment shaft and a ball bearing sleeve carried thereby into the bushing. In addition, a first set of rails is installed directly beneath a die member actuator, and a second set of rails is installed on the upper die member. The second set of rails slide upon the first set of rails, so that the upper die member effectively mechanically floats on the first set of rails. The lower die member is affixed to a translatable platen, which is driven to an end stop position at the part excision station. Then, the upper die member is lowered onto the lower die member, so that the alignment pins contact the bores in the bushings on the lower die member. Any axial misalignment of the alignment shafts and the bushings is removed as the tapered surfaces of the alignment pins discs are translated by a horizontal force imparted by the bushings. As a result, the …
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.