Electroplating device & process
US5490917A · kind A · utility
3Cited by
2References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 10, 1994 |
| Grant date | Feb 13, 1996 |
| Priority date | — |
| Expiry date | Nov 10, 2014 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D17/20
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
This invention relates to a process and apparatus for electroplating that has an electrolyte continually circulating through a rotating plating barrel along with its parts to be plated by having a nozzle spray means with perforation on an elongated perforated tube that is positioned above the center of a barrel, whereby the spray means barrel is provided with recirculated electrolyte by means of a pump recirculating electrolyte from a plating tank to the elongated perforations while the barrel is rotating, so that the parts are agitated and greater speed and efficiency of the plating process can be achieved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.