Cadmium-free and lead-free thick film paste composition
US5491118A · kind A · utility
41Cited by
7References
9Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 20, 1994 |
| Grant date | Feb 13, 1996 |
| Priority date | — |
| Expiry date | Dec 20, 2014 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC03C3/062
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
The invention is directed to a lead-free and cadmium-free thick film paste composition suitable for forming resistor or thermistor patterns on a substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.