Themoplastic molding compounds
US5491181A · kind A · utility
2Cited by
9References
9Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 22, 1994 |
| Grant date | Feb 13, 1996 |
| Priority date | — |
| Expiry date | Jul 22, 2014 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC04B2235/5436
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
Thermoplastic molding compounds containing at least one coated ceramic powder and at least one thermoplastic binder, to a process for preparing coated ceramic powders and to a process for producing molded components from ceramic powders. The ceramic powder is coated with at least one ionic, non-ionic or zwitterionic dispersant based on an organic or organometallic compound.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.