Surface mount interposer
US5491303A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Mar 21, 1994 |
| Grant date | Feb 13, 1996 |
| Priority date | — |
| Expiry date | Mar 21, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An interposer (100) for connecting two or more printed circuit boards (302, 304) is a circuit-carrying substrate (102) with two or more solder pads (104, 109)on each of two sides (105, 107). Each of the solder pads are connected to an electrically conductive via (106) in the substrate, providing electrical interconnection from one side to the other side. Each solder pad has a solder bump (108) on it. A circuit assembly is made by soldering the solder bumps on one side of the interposer to corresponding solder pads on a printed circuit board (302). The solder bumps on the other side of the interposer are likewise soldered to the corresponding solder pads of a second printed circuit board (304).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.