Semiconductor device having peripheral metal wiring
US5491352A · kind A · utility
66Cited by
3References
18Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 6, 1994 |
| Grant date | Feb 13, 1996 |
| Priority date | — |
| Expiry date | Oct 6, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S257/92
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
At a peripheral area of a semiconductor chip where active elements are not formed, a layer underlying a power supply wiring or ground wiring is provided with an uneven surface. The uneven or corrugated surface at the interface between the wiring and the underlying layer makes the wiring unsusceptible to slide. The uneven surface can be realized by interposing foreign matters between insulating layers, by selectively reducing the thickness of an insulating layer, or by forming openings in an insulating layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.