Method for mounting component chips and an apparatus therefor
US5491888A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 30, 1994 |
| Grant date | Feb 20, 1996 |
| Priority date | — |
| Expiry date | Sep 30, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53261
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A number of embodiments of component pick up and mounting devices that include a plurality of pick up heads. The speed of the device is improved by providing sensing of the orientation of the components picked up by the pick up devices in a common sensing station. The device also includes means whereby one of the pick up devices may pick up a component large enough to interfere with the picking up of components by the other pick up devices by precluding the picking up of components by the other pick up devices when such a component is picked up by the one pick up device. The device further increases the speed by permitting pick up, recognition and correction of component orientation and mounting either simultaneously or operation of two or more of these functions at the same time on different pick up devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.