Patent · US Expired

Method and apparatus of mounting a package housing and ground strap

US5491892A · kind A · utility

33Cited by
3References
13Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJun 16, 1994
Grant dateFeb 20, 1996
Priority date
Expiry dateJun 16, 2014

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T29/49174
  • WIPO fieldElectrical machinery, apparatus, energy
  • WIPO sectorElectrical engineering

Abstract

A ground strap and vibration mount assembly (10) effectively mechanically isolates an electronic component from vibration while also providing an electrically conductive path to ground potential. The assembly (10) includes a vibration dampener (16) mounted through an opening (28) formed in a tab (12) projecting from the housing of the vibration sensitive electronic component. An insert (18) is provided therein and a mounting bolt (54) is positioned through a suitable opening (36) formed through the insert (18). An electrically conductive ground strap (40) is wrapped partially around the tab (12). An aperture (52) is formed in one portion (50) of the strap (40) and the bolt (54) passed therethrough. Opposing ends (42) of the electrically conductive connector (40) are secured to the tab (12).

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.