Substrate subassembly and method of making transistor switch module
US5492842A · kind A · utility
36Cited by
12References
8Claims
0Family size
Assignee
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Key dates
| Filing date | Jan 30, 1995 |
| Grant date | Feb 20, 1996 |
| Priority date | — |
| Expiry date | Jan 30, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49004
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate subassembly for a high power module, and methods involving the same. The substrate subassembly contains only one switching transistor and has at least one integral short terminal lead tab. The substrate subassemblies can be pretested at significant operating current, to obtain enhanced characterization and matching of mounted switching transistors. Trimmable gate lead resistances can be incorporated in the substrate subassemblies. Enhanced compositional, geometrical and electrical module symmetry is available. New module structures and method are afforded.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.