Structure for repairing semiconductor substrates
US5493076A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 26, 1995 |
| Grant date | Feb 20, 1996 |
| Priority date | — |
| Expiry date | Jan 26, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49742
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention relates generally to a new structure and a method for repairing semiconductor substrates, and more particularly, the invention encompasses a structure and a method for repairing Printed Circuit Boards or other electronic substrates by providing electrical lines on the defective board. On a substrate that has an open or an electrical discontinuity, after the discontinuity has been established, a portion of the electrical line across from the electrical discontinuity are exposed and one or more trenches or grooves are made between the two or more exposed portions of the electrical line. The two exposed portions of the exposed electrical line is then joined by either an electrical wire that is routed through the trench or using a standard deposition process one or more metals or material are deposited in the open trench to provide or restore electrical continuity and the excess deposition material is removed. This invention also provides means for impedance matching of the net that is repaired.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.