Ultrasonic transducer array having laser-drilled vias for electrical connection of electrodes
US5493541A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Dec 30, 1994 |
| Grant date | Feb 20, 1996 |
| Priority date | — |
| Expiry date | Dec 30, 2014 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB06B1/0622
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A system and process for electrically connecting all elements in a transducer array from one side. A flat block of piezoelectric ceramic material is patterned and drilled with a high-powered laser. The drilling is precisely controlled to define a series of vias which penetrate the ceramic block in the thickness direction. These vias facilitate electrical connection from one side of the ceramic block to the other side when the vias are sputtered or plated with electrically conductive material. In this way the electrodes on the front face of the transducer elements can be electrically connected from the rear to common ground or a signal source.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.