Method and apparatus for inspection of solder joints by x-ray fluoroscopic imaging
US5493594A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 7, 1994 |
| Grant date | Feb 20, 1996 |
| Priority date | — |
| Expiry date | Mar 7, 2014 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N23/044
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method and apparatus for inspecting a solder joint by an X-ray fluoroscopic image in which an X-ray is irradiated on an object to be inspected located by a specimen stage and having a lead of an electronic part soldered to a substrate to detect an X-ray fluoroscopic image signal, a position of a lead in a tip direction is obtained by a distribution of projection with said X-ray fluoroscopic image signal projected in a lead row direction, a position of a lead in a row direction is obtained by a distribution of projection with said X-ray fluoroscopic image projected in a lead tip direction to extract a position of a solder joint as an object to be inspected, and said X-ray fluoroscopic image is evaluated every solder joint in accordance with the postion information to effect a defect detection.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.