Cantilever spring and method for temporarily coupling a semiconductor device to a transmission line using the cantilever spring
US5494448A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 15, 1994 |
| Grant date | Feb 27, 1996 |
| Priority date | — |
| Expiry date | Mar 15, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R13/24
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A cantilever spring (16) and a method for temporarily coupling a semiconductor package (36) to a transmission line (14) by means of the cantilever spring (16). The cantilever (16) has first and second pressure points (22, 32) that contact the transmission line (14). A force is applied to a third pressure point (32) which moves the first and second pressure points in opposite directions along the transmission line (14). In addition, the force on the third pressure point moves an end (21) of the cantilever spring (16) in a direction away from the transmission line (14). A lead (37) from the semiconductor package (36) contacts a portion of the end (21). Electrical signals are transmitted between the semiconductor package (36) and a tester via the cantilever spring (16) and the transmission line (14), wherein the electrical signals are for testing a semiconductor device (30).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.