Teflon filled resinoid dicing blades for fabricating silicon die modules
US5494698A · kind A · utility
29Cited by
9References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 7, 1994 |
| Grant date | Feb 27, 1996 |
| Priority date | — |
| Expiry date | Nov 7, 2014 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB28D5/022
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A resinoid dicing blade having approximately a 20% by volume porosity structure is coated and impregnated with Teflon.RTM. by a process which impregnates the resinoid blade with Teflon.RTM. to about 0.3 to 0.5% by weight. The Teflon.RTM. impregnated dicing blades not only reduces nozzle chipping when bonded silicon wafers are separated into a plurality of individual printhead die, but blade life is significantly increased.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.