Radiation sensitive resin composition
US5494777A · kind A · utility
14Cited by
6References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 19, 1994 |
| Grant date | Feb 27, 1996 |
| Priority date | — |
| Expiry date | Apr 19, 2014 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/0045
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A radiation sensitive resin composition which can be suitably used as a negative type resist having a high sensitivity, a high resolution, a high yield of residual film thickness and high thermal resistance, and which comprises (A) an alkali-soluble novolak resin, (B) a phenolic compound having a standard polystyrene-reduced weight average molecular weight of 10,000 or less such as polyvinylphenol, (C) a compound capable of cross-linking the component (A) and/or the component (B) in the presence of an acid, and (D) a radiation sensitive acid generator such as a triazine compound having a halomethyl group.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.