Method for manufacturing printed circuit board
US5494781A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 4, 1994 |
| Grant date | Feb 27, 1996 |
| Priority date | — |
| Expiry date | Aug 4, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S430/146
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for manufacturing a printed circuit board is to form on a top surface of an insulating substrate a layer of such plating ground as a metal film, to irradiate such electromagetic wave as a laser to a boundary edge zone of non-circuit parts with respect to circuit-printing parts on the insulating substrate in correspondence to a pattern of the non-circuit parts to remove the plating ground layer at the part irradiate by the electromagnetic wave with the plating ground layer at the non-irradiated part left as formed, and thereafter to form a plating on the surface of the plating ground layer at the non-irradiated parts, whereby it is enabled to allow the laser irradiation to be carried out only with respect to the boundary edge zone of the non-circuit parts, without irradiating all over the non-circuit parts.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.