Method of pattern formation utilizing radiation-sensitive resin composition containing monooxymonocarboxylic acid ester solvent
US5494784A · kind A · utility
11Cited by
13References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 16, 1994 |
| Grant date | Feb 27, 1996 |
| Priority date | — |
| Expiry date | Dec 16, 2014 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/0085
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A radiation-sensitive resin composition comprising a solution of an alkali-soluble resin and a radiation-sensitive compound in a solvent comprising a monooxymonocarboxylic acid ester. This composition has a high storage stability (i.e., a very small amount of fine particles are formed during storage) and is suited for use as a resist for making integrated circuits.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.