Epoxy resin composition containing alkylated hydroquinone epoxide
US5494950A · kind A · utility
24Cited by
3References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 6, 1994 |
| Grant date | Feb 27, 1996 |
| Priority date | — |
| Expiry date | Apr 6, 2014 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G59/38
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An epoxy resin composition comprising an epoxy resin component containing at least 5% by weight of an epoxy resin of Formula [I], an epoxy hardener, and an inorganic filler as essential constituents: ##STR1## [wherein R and R.sup.1 denote alkyl of C.sub.2 to C.sub.6, and n is an integer repetition unit from 0 to 10.]. The epoxy resin composition, when used as a molding material, is low in water absorption rate and flexural modulus (low stress).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.