Method and assembly for mounting an electronic device having an optically erasable surface
US5495450A · kind A · utility
9Cited by
4References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 25, 1994 |
| Grant date | Feb 27, 1996 |
| Priority date | — |
| Expiry date | Nov 25, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15151
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit (106) having an optically erasable portion (114) is joined to a substrate (102) such that the optically erasable portion faces the substrate. The substrate (102) includes an aperture (104) that exposes the optically erasable portion (114) of the integrated circuit providing erasing capability to the integrated circuit (106). A plug (110) impermeable to light may be inserted into the aperture (104) to provide a sealed window to the optically erasable portion (114) of the integrated circuit (106).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.