Process for providing a landless via connection
US5495665A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 4, 1994 |
| Grant date | Mar 5, 1996 |
| Priority date | — |
| Expiry date | Nov 4, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49126
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A process for connecting at least two electrically conductive patterns through a dielectric material by a landless electrical connection is provided. The process includes providing a composite containing a dielectric substrate having a conductive plane on at least one of its major surfaces and a temporary support layer covering the conductive plane. Blind vias are provided in the dielectric substrate and are plated with an electrically conductive material. The temporary support layer is removed thereby providing a landless electrical connection through the dielectric material and the conductive plane is available for providing external electrical conductive pattern.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.